摘要 聚酰亚胺(PI)薄膜因具有优良的热稳定性、良好的机械强度等性能广泛应用于航空航天、微电子等领域,但应用在光学成像方向的报道极少。要将PI薄膜用于成像,对其本身的光学均匀性要求极为苛刻。本文实现了100 mm口径低热膨胀系数抗拉伸PI薄膜的光学均匀性满足瑞利判据,具有了成像领域应用的潜力。除了光学均匀性之外,该PI的拉伸强度为285 MPa,是PMDA-ODA型PI拉伸强度的~2.6倍;热膨胀系数约为3.2 ppm·K-1,可以与Novastrat■905相媲美,比商品化PI薄膜低一个数量级。这些优良的基础性能为进一步改进PI薄膜的空间适应性预留了更大的空间。PI光学均匀性的解决将为其在薄膜衍射光学元件中的应用奠定基础。 Polyimide(PI)film is widely used in aerospace,microelectronics,and other fields because of its excellent thermal stability and mechanical strength.However,there are very few reports about its application in the direction of optical imaging.To use PI film for imaging,the requirements for the optical homogeneity of the PI film are extremely demanding.The optical homogeneity of the stretch-resistant PI film proposed in this paper with 100 mm diameter and low thermal expansion coefficient meets the Rayleigh criterion,which has the potential for applications in the imaging field.In addition,the tensile strength of this PI is 285 MPa,which is~2.6 times that of the PMDA-ODA type PI;the coefficient of thermal expansion is about 3.2 ppm·K-1,which is comparable to that of the Novastrat■905 type PI and is one order of magnitude lower than that of the commercial PI films.These excellent basic properties reserve more space to further improve the space adaptability of the PI film.The solution of the optical homogeneity of the PI film will lay the foundation for its application in thin film diffractive optical elements.
机构地区 中国科学院光电技术研究所 中国科学院大学
出处 《光电工程》 CAS CSCD 北大核心 2021年第4期78-84,共7页 Opto-Electronic Engineering
基金 国家重点研发计划地球观测与导航重点专项(2016YFB0500200)。
关键词 成像 低热膨胀系数 拉伸强度 光学均匀性 imaging low thermal expansion coefficient tensile strength optical homogeneity
